Mobile Parts

  • New

Qianli BGA Stencil iPhone 11

Product Details

Qianli BGA Stencil iPhone 11

Tool for reballing the two iPhone 11 motherboards. A complete process in a Tool from positioning to laying the firm dough to the formation of the balls.

Step 1: Place the motherboard
Step 2: Insert the magnetic template
Step 3: Roll out the firm dough at low temperature
Step 4: Place the cover to protect the board
Step 5: With hot air, the process ends by heating the tin until the balls form.