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2UUL Magnetic Universal BGA Reballing Stencil System | 5G-M
2UUL Magnetic Universal BGA Reballing Stencil System | 5G-M
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2UUL Magnetic Universal BGA Reballing Stencil System | 5G-M
2UUL Magnetic Universal BGA Reballing Stencil System | 5G-M

2UUL Universal BGA Reballing Stencil Magnetic

€12.00
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2UUL Universal BGA Reballing Stencil 

The 2UUL Universal Magnetic system is engineered to solve the common struggles of traditional reballing. With its powerful magnetic base, the stencil stays perfectly flush with the chip, eliminating the risk of solder bridges or foil warping caused by thermal expansion.

This universal set covers a vast range of BGA chips commonly found in modern smartphones, making it a versatile and essential tool for any micro-repair lab aiming for perfection.

🔬 Innovation and Design:

  • Magnetic Fastening: Optimized attraction force to keep the stencil flat and securely in place.
  • Japanese Steel: Made of high-quality alloy that resists high temperatures without warping.
  • Square Hole Design: Optimized hole design to facilitate the release of solder balls after melting.
  • Quick Alignment: Reduces preparation time thanks to the simplified alignment system.
  • Universal Compatibility: Grids calibrated for the most common pitches used in mobile electronics.

📋 Technical Specifications:

Brand:2UUL
Material:High-quality stainless steel
Feature:Magnetic Base Included
Application:Universal BGA Chip Reballing