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G-LON CPU Resin Removal Liquid 100ml
€7.50
Prices shown are exclusive of VAT.Applicable taxes will be calculated at checkout.
Pay in 3 interest-free installmentsG-LON CPU Resin and Glue Remover Liquid (100ml)
Simplify the most complex desoldering operations with the G-LON Resin Remover Liquid. Specifically designed for microelectronics laboratories, this professional solvent is indispensable for softening and removing stubborn "black glue" (underfill) and epoxy resin that seal CPUs, NAND memories, and integrated circuits (ICs) on motherboards.
Supplied in a generous 100ml bottle, the liquid penetrates quickly, reducing resin adhesion without damaging the delicate motherboard pads or component pins. This ensures a significantly safer, faster, and risk-free cleaning and reballing process, avoiding mechanical damage.
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Fast and Effective Action:By applying a few drops to the edges of the chip and gently heating, the liquid softens the hardened resin in moments, allowing for easy removal with a scalpel or probe.
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Maximum Safety for PCBs and Components:The special G-LON chemical formula is aggressive only on the sealing glue but is completely safe for the logic board. It prevents pad breakage and track tearing during chip lifting.
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Ideal for Advanced Work:An essential tool for technicians performing advanced repairs on latest-generation smartphones, data recovery, NAND memory replacement, or reballing of CPUs soldered with underfill.
Technical Details
| Brand / Model | G-LON / CPU Resin Removal Liquid |
| Main Application | Removal of black glue (Underfill) and epoxy resin from CPU/IC |
| Content and Quantity | 1 Bottle of G-LON Solvent (100ml) |