MiJing Z22 MAX Resin Removal and CPU Reballing iPhone (A13-A19 Pro)

€22.00

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MiJing Z22 MAX 2 in 1 Glue Removal and CPU Reballing Vise

The MiJing Z22 MAX 2 in 1 Multifunction Vise is a high-precision tool, essential in laboratories specializing in motherboard repair. This platform combines two fundamental functions into a single device: resin cleaning (degumming) and pin soldering (reballing) for BGA processors.

Equipped with an intelligent design, it optimizes the workflow by reducing transition times between the cleaning and tin planting phases. The kit includes calibrated BGA stencils for perfect magnetic alignment, allowing safe operation on Apple CPUs from the A13 series up to A19 Pro models.

2 in 1 Multifunction Design:Seamlessly integrates a station for safe epoxy glue removal and a platform for chip reballing. Allows processing of the processor in a single workstation, improving efficiency and cleanliness of the intervention.

Powerful Magnetic Fixation:Equipped with high-strength magnets, the vise ensures that the stencil and chip remain firmly locked during solder paste application. This prevents any slippage or loss of microscopic components.

Wide CPU Compatibility:Designed for the latest generation of telephony, it offers targeted support for iPhone CPUs (from A13 to A19 Pro), proving equally compatible and versatile for processing a wide range of Android device processors.

Product Specifications

Product	2 in 1 Magnetic Platform for Glue Removal and Reballing
Model	MiJing Z22 MAX
Compatibility	Apple A13 - A19 Pro CPUs and Android processors
Features	Powerful magnetic adsorption, high thermal resistance