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MiJing SP1 Chip Black Glue Cleaning Blade
€8.65
Prices shown are exclusive of VAT.Applicable taxes will be calculated at checkout.
Pay in 3 interest-free installmentsMiJing SP1 Glue Removal Scalpel for Chips and BGA
Optimize delicate microsoldering operations with this MiJing SP1 precision scalpel. The ideal solution for technicians and repairers who need to safely remove black glue (underfill) from CPUs, hard drives, and various BGA chips.
Extremely comfortable to use, the thin blade design allows it to easily slip under electronic components to remove structural adhesive residues. Specifically developed to eliminate failures during rework, its use eliminates the risk of scratching the surface of ICs, lifting pads, or damaging motherboard circuits.
Safe Technical Material:Made of special PI (VESPEL-SP1) engineering plastic material, resistant to high temperatures. When used with hot air, the material softens, increasing its flexibility, so it perfectly conforms to the surface for deep and safe cleaning.
Thin and Replaceable Blade:Features a 2mm detachable precision blade design, specifically designed to protect PCB pads while ensuring excellent handling and quick replacement in case of wear.
Stable Grip:The handle is designed to offer a firm control, ensuring constant movements and eliminating the risk of accidental slips that could compromise the board's integrity during scraping work.
Package Details
| Kit Content | 1 Handle with MiJing SP1 glue removal blade |
| Blade Material | Flexible engineering plastic (PI VESPEL-SP1) |
| Recommended Use | Underfill and resin removal from CPUs, ICs, and BGA chips |
