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XINZHIZAO Mould Samsung SM-S918 S23 Ultra | 5G-M Online Store
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XINZHIZAO Mould Samsung SM-S918 S23 Ultra | 5G-M Online Store

XINZHIZAO Mould Samsung SM-S918 S23 Ultra

€14.50
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XINZHIZAO Samsung S23 Ultra Mould - L2023 Module

This XINZHIZAO Mould is a specific expansion module for the L2023 preheating station. Custom-designed for the Samsung Galaxy S23 Ultra (SM-S918) motherboard, it maintains a constant temperature across the board, drastically facilitating the removal and replacement of critical components such as CPU, NAND, and integrated chips.

🌟 Professional Features:

  • Uniform Thermal Control: Distributes heat evenly across the entire motherboard surface to prevent thermal shock.
  • Soldering Optimization: Facilitates BGA component detachment by reducing the required hot air temperature.
  • Anti-Warping Design: High-conductivity copper/aluminum structure that keeps the board perfectly flat.
  • Quick Snap-In: Exclusively compatible with the XINZHIZAO L2023 base station for immediate setup.

📋 Technical Specifications:

Brand:XINZHIZAO
Base Compatibility:XINZHIZAO L2023 Station
Supported Model:Samsung Galaxy S23 Ultra (SM-S918)
Function:Motherboard Preheating / Reballing

Lab Advantage: Reduces the risk of CPU damage during micro-soldering tasks through assisted thermal management.