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XINZHIZAO L2023 Heating Mould iPhone 17 / Pro / Max / Air | 5G-M
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XINZHIZAO L2023 Heating Mould iPhone 17 / Pro / Max / Air | 5G-M

XINZHIZAO Mould iPhone 17 Series

€9.85
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XINZHIZAO iPhone 17 Series Mould - L2023 Module

This XINZHIZAO Mould is the latest generation expansion module for the L2023 station, specifically designed for the entire iPhone 17 range (including Pro, Max, and the new 17 Air models). Thanks to its advanced thermal conduction structure, it allows motherboards to be worked on at constant temperatures, facilitating sandwich layer separation and the safe removal of critical components.

🌟 Professional Features:

  • Multi-Model Support: A single module compatible with iPhone 17, 17 Pro, 17 Pro Max, and 17 Air.
  • Thermal Precision: Optimized heat distribution to protect CPU and NAND chips from localized overheating.
  • Premium Materials: Made of synthetic copper and CNC aluminum for exceptional thermal stability and durability.
  • Ease of Operation: Ergonomic design for fast positioning and effortless, simplified component removal.

📋 Technical Specifications:

Brand: XINZHIZAO
Base Platform: L2023 Heating Station
Compatibility: iPhone 17 / 17 Pro / 17 Pro Max / 17 Air
Function: Motherboard Separation / IC Cleaning / Reballing

Lab Advantage: Essential for complex micro-soldering tasks, it reduces processing times while ensuring maximum safety for the logic board.