NAVIGATION

Mobile Parts

MIJING MS1 Heating Module for iPhone 17 / Pro / Max / Air | 5G-M
Previous
Next
MIJING MS1 Heating Module for iPhone 17 / Pro / Max / Air | 5G-M

MIJING MS1 Expansion Module iPhone 17 Series

€9.75
ADD TO CART
100% Secure Payments
PayPal
Visa
Mastercard
Amex
G-Pay
PP Pay in 3 interest-free installments

MIJING MS1 Expansion Module iPhone 17 Series

This MIJING MS1 expansion module is specifically designed for micro-soldering professionals working on the new iPhone 17 range (including 17 Pro, 17 Pro Max, and 17 Air). Used in conjunction with the MIJING MS1 base station, it allows for safe and precise separation of double-stacked logic boards (sandwich).

🌟 Professional Features:

  • Full 17 Series Compatibility: A single mold for iPhone 17, 17 Pro, 17 Pro Max, and the new ultra-slim 17 Air design.
  • Localized Heating: Engineered to focus heat exclusively on soldering zones, protecting surrounding sensitive components.
  • High-Density Materials: Crafted from high-quality copper for rapid and uniform thermal conductivity.
  • Precision Alignment: Millimeter-perfect contoured slots to ensure board stability during cleaning and reballing operations.

📋 Technical Specifications:

Brand: MIJING
Base Compatibility: MIJING MS1 Heating Station
Supported Models: iPhone 17 / 17 Pro / 17 Pro Max / 17 Air
Function: Sandwich Separation / IC Removal / Reballing

Lab Advantage: The MIJING MS1 system is renowned for its thermal stability, drastically reducing the risk of motherboard damage during repair.