NAVIGATION

Mobile Parts

Mechanic BGA Reballing Stencil for iPhone 17 Air - Middle Layer
Precedente
Successivo
Mechanic BGA Reballing Stencil for iPhone 17 Air - Middle Layer

Mechanic Middle Layer BGA iPhone 17 Air

€3.75
ADD TO CART
100% Secure Payments
PayPal
Visa
Mastercard
Amex
G-Pay
PP Pay in 3 interest-free installments

Mechanic Middle Layer BGA Reballing Stencil for iPhone 17 Air

The Mechanic IP17 Air Middle Layer stencil is a surgical-precision technical tool, developed for the challenges posed by the ultra-thin design of the iPhone 17 Air. This stencil is indispensable for middle layer reballing, ensuring a perfect connection between the levels of the sandwich motherboard.

✨ Professional Features:

  • Designed for iPhone 17 Air: Specifically optimized for the component density and thermal layout of the Air model.
  • Laser Square Hole Technology: Conical micro-holes guarantee uniform solder paste distribution and instant release without residues.
  • Superior Thermal Resistance: Industrial-grade steel that prevents heat deformation, maintaining constant planar contact with the PCB.
  • Non-Stick Surface: Special treatment to facilitate cleaning and detachment (Toughness and easy to remove paste).

📋 Product Specifications:

Brand: Mechanic (Show the Style of Master)
Model: IP17 Air Middle Layer Stencil
Compatibility: iPhone 17 Air
Material: High-elasticity stainless steel