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Mechanic Middle Layer BGA iPhone 17 Air
€3.75
Prices shown are exclusive of VAT.Applicable taxes will be calculated at checkout.
Pay in 3 interest-free installmentsMechanic Middle Layer BGA Reballing Stencil for iPhone 17 Air
The Mechanic IP17 Air Middle Layer stencil is a surgical-precision technical tool, developed for the challenges posed by the ultra-thin design of the iPhone 17 Air. This stencil is indispensable for middle layer reballing, ensuring a perfect connection between the levels of the sandwich motherboard.
✨ Professional Features:
- Designed for iPhone 17 Air: Specifically optimized for the component density and thermal layout of the Air model.
- Laser Square Hole Technology: Conical micro-holes guarantee uniform solder paste distribution and instant release without residues.
- Superior Thermal Resistance: Industrial-grade steel that prevents heat deformation, maintaining constant planar contact with the PCB.
- Non-Stick Surface: Special treatment to facilitate cleaning and detachment (Toughness and easy to remove paste).
📋 Product Specifications:
| Brand: | Mechanic (Show the Style of Master) |
| Model: | IP17 Air Middle Layer Stencil |
| Compatibility: | iPhone 17 Air |
| Material: | High-elasticity stainless steel |