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Mechanic Middle Layer BGA iPhone 17 Pro Max | 5G-M Online Store

Mechanic Middle Layer BGA iPhone 17 Pro Max

€3.80
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Mechanic Middle Layer BGA Reballing Stencil for iPhone 17 Pro Max

The Mechanic IP17 Pro Max Middle Layer stencil is an advanced repair tool, designed to meet the rigorous standards of professional micro-soldering. This stencil allows for perfect reconstruction of solder balls on the middle layer of the iPhone 17 Pro Max motherboard, ensuring a flawless bond between the two layers (sandwich).

✨ Professional Features:

  • Pro Max Precision: Designed exclusively for the specific motherboard layout of the iPhone 17 Pro Max, with 1:1 alignment.
  • Square Hole Technology: Laser-cut holes with a conical profile allow solder paste to deposit evenly and release without smudging.
  • Extreme Heat Resistance: Made of anti-deformation Japanese steel that maintains flatness even during prolonged heating cycles.
  • Easy Release: Surface treated to reduce solder paste adhesion (Toughness and easy to remove paste).

📋 Product Specifications:

Brand: Mechanic (Show the Style of Master)
Model: IP17 Pro Max Middle Layer
Compatibility: iPhone 17 Pro Max
Material: High-toughness anti-corrosion steel