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Mechanic Middle Layer BGA iPhone 17 | 5G-M Online Store
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Mechanic Middle Layer BGA iPhone 17 | 5G-M Online Store

Mechanic Middle Layer BGA iPhone 17

€3.80
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Mechanic Middle Layer BGA Reballing Stencil for iPhone 17

The Mechanic IP17 Middle Layer stencil is a high-precision tool specifically designed for repairing and reballing the iPhone 17 "sandwich" motherboard. Made of high-quality stainless steel, it allows for flawless solder paste application.

✨ Professional Features:

  • Precision Square Holes: Advanced laser-cutting technology creates conical square holes that facilitate stencil release after application, preventing "bridging" between pads.
  • High Thermal Resistance: Designed to resist deformation under direct heat, maintaining the flatness required for perfect reballing.
  • Premium Material: Ultra-thin yet extremely flexible and durable Japanese steel (High toughness and easy to remove paste).
  • Easy Alignment: 1:1 mirror layout with the iPhone 17 logic board for quick and precise positioning.

📋 Product Specifications:

Brand: Mechanic (Show the Style of Master)
Model: IP17 Middle Layer Stencil
Compatibility: iPhone 17 (Double-layer logic board)
Material: High-toughness anti-deformation steel