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Relife HW21 Solder Paste 183° Lead-Free
€5.50
Prices shown are exclusive of VAT.Applicable taxes will be calculated at checkout.
Pay in 3 interest-free installmentsRELIFE HW21 Solder Paste 183°C in Jar
Achieve professional results in every microsoldering operation with RELIFE HW21 Solder Paste. Featuring a medium melting point of 183°C, it is the ideal solution for BGA reballing, SMD component soldering, and general repair of motherboards and electronic devices.
Its advanced and eco-friendly lead-free formula has been developed to offer strong activity and perfect consistency. It ensures solid, bright, and full solder joints, facilitating the technician's work and ensuring high-quality repairs over time.
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183°C Melting Point and Eco-friendly:Lead-Free and environmentally conscious composition. The 183°C melting point makes it extremely versatile and safe for most processes, preventing excessive thermal stress on surrounding components.
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No Collapse or Cold Solder Joints:Specifically designed to prevent "virtual welding" (cold solder joints) and collapse phenomena. It ensures a firm grip and a very high success rate during stenciling.
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Moderate Humidity and Long Shelf Life:The paste maintains a constant humidity level that prevents premature drying in the jar. Ideal for a wide range of applications: motherboards, LEDs, printed circuits, and microchips.
Technical Details
| Model | RELIFE HW21 |
| Key Specifications | 183°C Melting / Lead-Free / Strong Activity |
| Content and Quantity | 1 Jar RELIFE HW21 Solder Paste |
