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Stencil Amaoe U-QSU6 0.12mm Qualcomm SM8750 - 8635 - 7635 - 6450 - 7435 - 8650 - 4450 - 7550
€3.75
Prices shown are exclusive of VAT.Applicable taxes will be calculated at checkout.
Pay in 3 interest-free installmentsBGA Reballing Stencil Amaoe U-QSU6 0.12mm for Qualcomm CPU Rework
The Amaoe U-QSU6 stencil is an indispensable tool for technicians specialized in motherboard repair and CPU rework. Precisely designed for BGA (Ball Grid Array) reballing, this stencil ensures uniform and accurate application of solder balls, fundamental for restoring connectivity of the most modern Qualcomm processors, such as: SM8750, SM8635, SM7635, SM6450, SM7435, SM8650, SM4450, SM7550
Professional Advantages:
- Absolute Precision: Designed with a thickness of 0.12mm, it ensures perfectly aligned holes for clean and error-free BGA reballing.
- Broad Qualcomm Compatibility: Specific for CPU models SM8750, SM8635, SM7635, SM6450, SM7435, SM8650, SM4450 and SM7550, covering a wide range of devices.
- Durable Materials: Made of high-quality steel, it resists deformations caused by heat during the reflow process, ensuring multiple uses.
Detailed Technical Specifications:
| Brand: | Amaoe |
| Model: | U-QSU6 |
| Tool Type: | BGA Reballing Stencil for CPU |
| Thickness: | 0.12mm |
| Material: | High thermal resistance steel |
| Qualcomm Compatibility: | SM8750, SM8635, SM7635, SM6450, SM7435, SM8650, SM4450, SM7550 |