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Qianli iShuriken BGA Reballing T0.2mm

Qianli iShuriken BGA Reballing Scraping T0.2mm

€1.99
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Qianli iShuriken - T0.2mm Curved Precision BGA Scraper

The Qianli iShuriken is the ideal tool for BGA Reballing specialists. Thanks to its curved blade with a thickness of only 0.2mm, this scraper offers a perfect balance between flexibility and rigidity, making it ideal for pad cleaning and removing epoxy resins (Underfill) from integrated circuits.

Qianli's build quality ensures long-lasting sharpness and superior bending resistance, allowing you to operate under a microscope with absolute control, avoiding damage to the delicate tracks of the motherboard.

🔬 Qianli Technical Excellence:

  • Ultra-Thin Thickness: Only 0.2mm to slide under the densest components effortlessly.
  • Curved Profile: Ergonomic design for scraping away solder and glue with natural movements.
  • High-Strength Steel: Selected metal alloy to maintain the blade edge over time.
  • BGA Versatility: Designed for CPU, NAND memories, and power management chips.

📋 Technical Specifications:

Brand:Qianli ToolPlus
Model:iShuriken (Curved Blade)
Blade Thickness:0.2 mm
Material:High-flexibility Steel