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Qianli iShuriken BGA Reballing T0.2mm
Qianli iShuriken BGA Reballing Scraping T0.2mm
€1.99
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Qianli iShuriken - T0.2mm Curved Precision BGA Scraper
The Qianli iShuriken is the ideal tool for BGA Reballing specialists. Thanks to its curved blade with a thickness of only 0.2mm, this scraper offers a perfect balance between flexibility and rigidity, making it ideal for pad cleaning and removing epoxy resins (Underfill) from integrated circuits.
Qianli's build quality ensures long-lasting sharpness and superior bending resistance, allowing you to operate under a microscope with absolute control, avoiding damage to the delicate tracks of the motherboard.
🔬 Qianli Technical Excellence:
- Ultra-Thin Thickness: Only 0.2mm to slide under the densest components effortlessly.
- Curved Profile: Ergonomic design for scraping away solder and glue with natural movements.
- High-Strength Steel: Selected metal alloy to maintain the blade edge over time.
- BGA Versatility: Designed for CPU, NAND memories, and power management chips.
📋 Technical Specifications:
| Brand: | Qianli ToolPlus |
| Model: | iShuriken (Curved Blade) |
| Blade Thickness: | 0.2 mm |
| Material: | High-flexibility Steel |













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