Wylie WL207F Chip Removal Tool Ultra-Thin

€5.80

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Wylie WL207F Ultra-Thin Chip Removal Tool

Wylie WL207F ultra-high toughness precision blade, specifically designed for micro-electronics professionals. It is the ultimate tool for safe removal of integrated circuits (IC), CPUs, and NAND memories from smartphone and tablet motherboards.

Thanks to its extremely sharp profile and calibrated flexibility, it allows for gentle penetration under soldered components and safe removal of epoxy resin (underfill), without risking damage or tearing the delicate underlying PCB pads.

Ultra-Thin Profile:The tip reaches a minimum thickness, allowing it to slide with extreme ease into the microscopic spaces between the chip and the motherboard, ensuring smooth and controlled prying.

High Toughness and Flexibility:Made with special materials that offer the perfect balance between flexibility and mechanical resistance. The tool adapts to pressure without breaking and without permanently deforming.

Ergonomic Handle:Designed to offer a firm and non-slip grip. It ensures maximum stability and precision of hand movements, essential when working for long periods under the microscope.

Product Specifications

Product	Precision blade for Chip / IC removal
Model	Wylie WL207F
Features	Ultra-thin, high toughness, flexible
Ideal Use	CPU/NAND lifting, resin and underfill cleaning