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BGA Scraper for Glue Removal and Pad Cleaning | 5G-M
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BGA Scraper for Glue Removal and Pad Cleaning | 5G-M

BGA Chisel With Steel Blade

€1.30
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BGA Scraper - Steel Blade for Glue Removal and Pad Cleaning

This BGA scraper with a steel blade is the ideal tool for technicians who require quick and effective cleaning of the motherboard after desoldering IC, CPU, or NAND chips. Its specific flat spatula shape allows for the removal of "black glue" residues and the leveling of excess solder on pads with extreme precision.

The ergonomic handle offers a secure grip, allowing you to calibrate the force necessary to remove the resin without scratching the solder mask or damaging the underlying traces.

🔬 Technical Features:

  • Stainless Steel Blade: Heat and wear resistant, it maintains its edge even after many uses.
  • Wide Spatula Design: Covers a larger surface area compared to classic tips, ensuring perfectly flat pads.
  • Anti-Slip Handle: Knurled structure for maximum control during microscope operations.
  • Multipurpose: Excellent for removing UV glue, epoxy resin, and cleaning carbonized flux residues.
  • Interchangeable Blade: Screw fastening system for quick and safe blade replacement.

📋 Specifications:

Blade Material: Stainless Steel
Main Use: BGA Pad Cleaning, Resin Removal
Feature: Wide blade for solder leveling