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RELIFE RL-007GA Pad Repair Kit | BGA Solder Pad Repair | 5G-M
RELIFE RL-007GA Pad Repair Kit | BGA Solder Pad Repair | 5G-M
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RELIFE RL-007GA Pad Repair Kit | BGA Solder Pad Repair | 5G-M
RELIFE RL-007GA Pad Repair Kit | BGA Solder Pad Repair | 5G-M

Kit RELIFE RL-007GA Patch Solder Lug Jumper

€3.80
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RELIFE RL-007GA - Professional Damaged Pad Repair Kit

The RELIFE RL-007GA is the ultimate solution for micro-soldering technicians dealing with torn or damaged pads on the motherboard. This kit replaces the traditional "wire jumper" method, offering a variety of pre-cut shapes and sizes that perfectly mimic the original pads of BGA chips.

Its use is extremely simple: just choose the correct shape from over 100 variants available in the kit, apply it to the missing pad, and secure it. Thanks to its ultra-thin structure and excellent conductivity, it guarantees an aesthetically clean and functionally indistinguishable repair from the original, greatly facilitating subsequent chip reballing.

It is an indispensable tool for restoring broken connections under CPUs, NAND memories, or Audio ICs, drastically reducing repair times while maintaining the highest quality standards.

✨ Key Highlights:

  • Efficiency: No more need to manually create copper wire coils.
  • Total Variety: Includes circular, square, and rectangular pads of every common size.
  • Stability: Once soldered and protected with solder mask, they become one with the PCB.
  • RELIFE Quality: Made of high-purity copper for perfect electrical conductivity.

📋 Technical Specifications:

Brand / Model:RELIFE RL-007GA
Application:BGA / IC Torn Pad Repair
Content:Sheets with assorted pre-cut shapes
Material:High-purity Copper