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Relife RT-404 Solder Paste Low Temperature 138°C
€5.80
Prices shown are exclusive of VAT.Applicable taxes will be calculated at checkout.
Pay in 3 interest-free installmentsLow Temperature Solder Paste 138°C RELIFE RL-404 (40g)
Perform high-end device repairs with complete safety using the RELIFE RL-404 low temperature solder paste (138°C). Specially formulated for advanced smartphone repairs (such as iPhone series motherboards) and microelectronics, this product effectively prevents thermal damage to the most sensitive components during soldering and desoldering phases.
Composed of an eco-friendly lead-free alloy (Sn42/Bi58), this paste ensures excellent printability and perfect adhesion. Its "Lead-Free" formula respects the environment, while its very fine texture ensures smooth work, without dripping and with professional results on every type of circuit.
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Low Melting Point (138°C):Melts quickly at just 138°C, drastically reducing thermal stress. It is the essential choice for protecting delicate components, plastic connectors, and heat-sensitive chips during hot air station interventions.
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Optimal Viscosity (No Sag, No Offset):Ensures extremely precise application through BGA stencils. The paste does not collapse, smudge, or shift after application, offering perfect component positioning.
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Bright and Full Joints:Despite the low temperature, it generates strong, shiny, and void-free solders (no false welding). Ideal for motherboards, memory chips, sensors, LED displays, and printed circuit boards (PCB/SMD).
Technical Details
| Model | RELIFE RL-404 |
| Main Specifications | Melting 138°C / Sn42-Bi58 Alloy / Lead-Free |
| Content and Quantity | 1 Jar RELIFE RL-404 Solder Paste (40g) |
